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台积电下注基于 MicroLED 的光互联技术

2025-05-27 18:26 by 一九八四

由于大模型等的计算需求,AI 集群在数据量、带宽、延迟和速度上面临前所未有的挑战。连接处理器和内存的铜线迟早会被光学元件所取代。目前流行的光连接芯片使用了激光器,而激光器的可靠性、制造和费用是基于激光的光互连技术面临的主要挑战。现在台积电宣布与创业公司 Avicena 合作生产基于 microLED 的互连产品。这项技术旨在用光连接取代电连接,以低成本高能效的方式满足 GPU 之间的通信需求。Avicena 使用了数百个通过成像型光纤连接的蓝色 microLED 去转移数据,避免了激光器以及相关的复杂性问题,

spectrum.ieee.org/microled-optical-chiplet

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台积电下注基于 MicroLED 的光互联技术

2025-05-27 18:26 by 一九八四

由于大模型等的计算需求,AI 集群在数据量、带宽、延迟和速度上面临前所未有的挑战。连接处理器和内存的铜线迟早会被光学元件所取代。目前流行的光连接芯片使用了激光器,而激光器的可靠性、制造和费用是基于激光的光互连技术面临的主要挑战。现在台积电宣布与创业公司 Avicena 合作生产基于 microLED 的互连产品。这项技术旨在用光连接取代电连接,以低成本高能效的方式满足 GPU 之间的通信需求。Avicena 使用了数百个通过成像型光纤连接的蓝色 microLED 去转移数据,避免了激光器以及相关的复杂性问题,

spectrum.ieee.org/microled-optical-chiplet

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